Siemens Simcenter FloTHERM 2021.2.0 x64

FloTHERM 使用先进的 CFD 技术来预测组件、电路板和完整系统（包括机架和数据中心）中的气流、温度和热传递。它还是业界与 MCAD 和 EDA 软件集成的最佳解决方案。FloTHERM 是电子热分析领域无可争议的世界领导者，拥有 98% 的用户推荐评级。它支持的用户、应用示例、库和已发表的技术论文比任何竞争产品都多。

特征：

加速热设计工作流程
FloTHERM 与流行的 MCAD 和 EDA 工具集成。其 XML 导入功能简化了模型的构建和求解，自动对结果进行后处理。FloTHERM 的自动顺序优化和 DoE 功能减少了达到优化设计所需的时间，使其能够深入嵌入设计流程中。

强大的网格划分和快速求解器
FloTHERM 让工程师可以专注于设计，在工程时间范围内提供最准确的结果。其 SmartParts 和结构化笛卡尔方法为每个网格单元提供了最快的求解时间。FloTHERM“局部网格”技术支持解决方案域不同部分之间的整体匹配、嵌套、非共形网格接口。

可用性和智能热模型
FloTHERM 中的整体模型检查让用户可以查看哪些物体附有材料、附在每个物体上的功率以及相应的装配级功耗。它还识别对象是否正在创建网格线。
FloTHERM SmartParts 代表来自大量供应商的 IC 到完整的电子产品机架，简化了模型创建，以最大限度地减少求解时间并最大限度地提高求解精度。

从组件到系统的热表征和分析将
FloTHERM 与 T3Ster 瞬态热表征相结合，用于对真实世界电子设备进行热仿真。由于热问题会导致组件的可靠性呈指数级下降，因此使用 T3Ster 可以让制造商设计出具有卓越热性能的芯片、IC 和 PCB。他们还可以为下游应用发布可靠的热数据。

现在 FloTHERM 可以使用与 T3Ster 相同的数学过程将模拟的瞬态热响应转换为结构函数曲线。已知这些结构函数曲线与器件的物理结构相关，因此是比较仿真结果与实际测试数据的理想平台。FloTHERM 的指挥中心现在提供封装热模型的自动校准，以匹配 T3Ster 结果，确保正确的热响应，而与功率脉冲的长度无关。设备制造商和系统集成商现在可以使用校准模型来设计更可靠的产品，避免在产品的整个生命周期内因热引起的故障。

File Size: 1.1 GB

FloTHERM uses advanced CFD techniques to predict airflow, temperature, and heat transfer in components, boards, and complete systems, including racks and data centers. It’s also the industry’s best solution for integration with MCAD and EDA software.FloTHERM is the undisputed world leader for electronics thermal analysis, with a 98 percent user recommendation rating. It supports more users, application examples, libraries and published technical papers than any competing product.

Features:

Accelerated Thermal Design Workflow
FloTHERM integrates with popular MCAD and EDA tools. Its XML import capability simplifies building and solving models, post-processing results automatically. FloTHERM’s automatic sequential optimization and DoE capabilities reduces the time it takes to reach optimized design, allowing it to be deeply embedded in the design flow.

Robust Meshing and Fast Solver
FloTHERM lets engineers focus on design, delivering the most accurate results possible within engineering timescales. Its SmartParts and structured-Cartesian method offers the fastest solution time per grid cell. The FloTHERM “localized-grid” technique supports integrally matched, nested, non-conformal grid interfaces between different parts of the solution domain.

Usability and Intelligent Thermal Models
Integral model checking in FloTHERM lets users see which objects have attached material, the power attached to every object, and corresponding assembly-level power dissipation. It also identifies whether the object is creating a mesh line.
FloTHERM SmartParts represent ICs to full racks of electronics from a large list of suppliers, streamlining model creation to minimize solve times and maximize solution accuracy.

Thermal Characterization and Analysis from Component to System
Combine FloTHERM with T3Ster transient thermal characterization for thermal simulation of real-world electronics. Since reliability of components can decrease exponentially due to heat problems, using T3Ster lets manufacturers design chips, ICs, and PCBs of superior thermal performance. They can also publish reliable thermal data for downstream applications.

Now FloTHERM can convert a simulated transient thermal response into a structure function curve using the same mathematical process utilized by T3Ster. These structure function curves are known to correlate with the physical structure of the device, and are thus the ideal platform to compare simulation results with actual test data. FloTHERM’s Command Center now provides automated calibration of the package thermal model to match the T3Ster results, ensuring the correct thermal response irrespective of the length of the power pulse. Equipment manufacturers and systems integrators can now use calibrated models to design even more reliable products, avoiding thermally-induced failures throughout the product’s lifetime.

Whats New:
official site does not provide any info about changes in this version.