
在本课程中,我们将研究材料原子结构的基本原理以及这些材料中缺陷的影响。从埃长度尺度开始,我们将首先检查键合,具体确定分子内和分子间相互作用之间的差异。此外,这些相互作用将在相互作用的能量和电负性之间进行区分。然后,我们将建立在这些概念的基础上,并将其应用于 X 射线衍射。建立到纳米长度尺度,我们将检查晶体材料中的结构基序,特别是我们如何开发简单立方、体心立方和面心立方的晶胞。最后,我们将检查材料中的 0、1、2 和 3D 缺陷。对于 0D 缺陷,我们将检查和调查空位、间隙、以及如何计算这些缺陷的平衡浓度以及 Arrhenius 温度依赖性。此外,用于在离子晶体中写入缺陷的 0D Kroger-Vink 符号。将研究内在和外在缺陷。对于一维缺陷,我们将主要关注边缘和螺钉缺陷。这些缺陷可以通过在平面上绘制 Burger 的电路来确定缺陷的类型。对于 2D 和 3D 缺陷,我们将检查晶界和空隙。这些缺陷可以通过在平面上绘制 Burger 的电路来确定缺陷的类型。对于 2D 和 3D 缺陷,我们将检查晶界和空隙。这些缺陷可以通过在平面上绘制 Burger 的电路来确定缺陷的类型。对于 2D 和 3D 缺陷,我们将检查晶界和空隙。
MP4 | Video: h264, 1280×720 | Audio: AAC, 44.1 KHz, 2 Ch
Genre: eLearning | Language: English + srt | Duration: 30 lectures (4h 30m) | Size: 1.95 GB
Materials Science and Engineering
What you’ll learn
Material Science and Engineering
Structure of Materials
Defects
Phase Diagrams
Requirements
Undergraduate Math and Physics Concepts
Description
In this course we will examine the fundamentals of the atomistic structure of materials and the effect of defects in these materials. Starting at the angstrom length scale we will first exam bonding specifically determining the difference between intramolecular and intermolecular interactions. Additionally, these interactions will be differentiated between the energy of interactions and electronegativity. We will then build upon these concepts to and apply this to X-Ray diffraction. Building up to the nanometer length scale we will examine the structural motifs in crystalline materials specifically how we develop unit cells of simple cubic, body centered cubic, and face centered cubic. Finally, we will examine 0, 1, 2, and 3D defects in materials. For 0D defects we will examine and investigate vacancies, interstitial, and how to calculate the equilibrium concentrations of these defects as well as the Arrhenius temperature dependence. Additionally, 0D Kroger-Vink notation for writing defects in ionic crystals. Both intrinsic and extrinsic defects will be investigated. For 1D defects we will focus primarily on edge and screw defects. These defects can be determined by drawing Burger’s circuits in a plane to find the type of defect. For 2D and 3D defects we will examine grain boundaries and voids.
Who this course is for
Undergraduate Engineering Students
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